Longsys New Beginning at CES


There’s no other event experience like CES, and Longsys is very proud to take its first step on the show from the 6th to 9th of January.

Come to our booth and discover in first-hand our innovative consumer storage products, embedded products, and other top of the line application products.
See you at the Las Vegas Convention Center!
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Longsys Technology launches the world’s smallest IoT WiFi SiP module


LAS VEGAS, Jan. 4, 2016 /PRNewswire/ — Longsys Technology, the leading solutions provider for the Internet of Things (IoT), just announced the world’s smallest IoT WiFi Silicon-in-package (SiP) module, LTP0201, which is designed for IoT and wearable devices that can connect to other smart devices or directly connect to the Internet for cloud-based data analytics and enhanced services. Read More

Longsys 3D NAND TLC SSD Leads New Trend


longsys new SSD product S409 Series is the first SSD based on 3D TLC NAND Flash in China and it will be put into mass production in September. It will meet the demands of various consumers (users) and provide better performance experience for its remarkable performance, low power consumption and high reliability.

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How Longsys builds a win-win SSD ecology?


According to the data of Forward indights, market size of global memory chips in 2015 was about USD 80 billion and demand on flash memory chips in China was over USD 10 billion. The data of DRAM eXchange predicts that overall consumption of SSD in 2016 will exceed that of embedded chips for the first time, thus becoming the first big application of NAND FLASH memory.

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Longsys Continues Cultivating Mobile Storage Devices’ End-market


In the past few years, data storage demand has been picking up momentum year by year, especially in mobile smart devices’ storage application segments. According to sources, global storage chips amounted to nearly US$ 80 billion in value. For China alone, its Flash memory demand reached US$ 10 billion, and embedded storage occupied more than 80% of the market demand.
Naturally, China’s largest storage firm, ShenZhen Longsys Electronics Co ., Ltd (aka Longsys) would never miss this enormous opportunity from the mobile smart devices’ storage market. During the recent GSMA Mobile World Congress in Shanghai, Longsys proactively participated and showcased its latest embedded and mobile storage products and technologies. Read More

longsys Embedded Private Show at Mobile World Congress – Shanghai


As the supporting sponsors of Mobile World Congress – Shanghai (2016.06.29–07.01), longsys is going to hold a embedded private show at  the N1.D86 MR in Shanghai New International Expo Center.

We will launch our TLC SSD with Marvell controller inside, M.2 PCIE SSD, external SSD, eMMC & eMCP etc.
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Leading Chinese storage device maker Longsys taps into IoT market with custom-made solutions


China’s leading memory module maker Shenzhen Longsys Electronics Co. uses its experiences and advantage in the memory industry as well as its keen sense of the market potential to take on the market transformation, as the technology industry moves from the PC era, in which a handful of firms dominated the market, toward integration of industries.

Longsys’ ambition did not go unnoticed during the Computex 2016. Kevin Wang, Longsys’ vice president of sales, led his team during the tradeshow and deepened cooperation with existing clients, as well as opened up business opportunities with customized solutions, in order to expand the company’s presence into the promising Internet of Things (IoT) and VR/AR.

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2016 longsys Private Show(Taipei)


longsys is going to hold a private exhibition during Computex 2016 TAIPEI period at Grand Hyatt Hotel, which is beside 101tower.
We will launch our High Speed Memory card, USB Drive (3.0) for iOS & PC, Type-C flash drive, TLC SSD with Marvell controller inside, M.2 PCIE SSD, external SSD, eMMC & eMCP etc.
Welcome to visit us at our hotel showroom and book private meeting with us in advance. Read More

longsys Launched Embedded Modules EUDM2.0/EUDM3.0


Longsys launched and already mass produced embedded modules EUDM2.0 and EUDM3.0, which adopt FLASH from original manufacturers with the capacity of 8GB~128GB for selection. By applying BGA package, longsys EUDM2.0 and EUDM3.0 size is only 11.3mm*15.0mm*1.0mm with low power consumption, moreover, they are backward compatible with USB2.0 and 1.1 interface and support low standby current of 40mA (maximum) and inSLC block for accelerated write-in of initial data with the speed up to 20MB/s.

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