On December 2, 2015, Shenzhen Longsys and IBM signed a cooperation agreement on cloud platform technologies. Longsys will combine its advantages in IoT module research and production and IBM’s SuperVessel cloud platform technology and data services to help users quickly build a secure and reliable IoT cloud data services system.
In the era of big data, individuals, enterprises, internet and countries have increasing demand on data storage. Market size of global memory chips is about USD 80 billion and demand on flash memory chips in China is over USD 10 billion. SSD is going through rapid growth at an alarming rate. Moreover, the intention of mergers and acquisitions, investment and cooperation in storage business recently is to exploit huge potentialities of SSD in the field of big data storage.