• bob体育注册_BOBAPP_bob体育客户端

    Application:

    laptop、computer、pad

    Applications
    Product Details

    特性:

    1. 一体化封装,尺寸仅为33.4mm×17.mm×1.23mm

    2. 低功耗:1430mW

    3. 重量:1.9g




    Specifications
    Product   Series 
    Interface
    Form Factor  
    Density 
    NAND Flash  
    Operating   Temperature
    Seq   Read/Write(MB/s)
    IOPS   Read/Write(K) 

    SATA III 6Gb/s
    BGA 
    128GB~512GB
    3D TLC Flash
    0-70℃
    Up to 560MB/s /520MB/s
    Up to 90K/80K






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