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    Package:FBGA153

    Flash Type :3D NAND/ 2D MLC

    Density:16G/ 32G/64G/128G

    Dimension:11.5mmX13mm

    Operating Temperature:-25~85℃/-40~85℃

    Applications
  • Product Details

    Meet the requirements of industrial working environment.

    Longsys develops firmware programs for industrial environments.

    High durability.

    Strictly selecting supply chain resources and testing requirements.




    Specifications
    产品种类
    Density
    Operating   Temperature
    Flash Type 
    Package
    Dimension
    Industrial eMMC
    16GB
     -25~85℃
    3D NAND/2D MLC
    FBGA153
    11.5X13mm
    32GB
    3D NAND
    FBGA153
    11.5X13mm
    64GB
    3D NAND
    FBGA153
    11.5X13mm
    128GB
    3D NAND
    FBGA153
    11.5X13mm
    Industrial eMMC
    8GB
     -40~85℃
    MLC
    FBGA153
    11.5X13mm
    16GB
    MLC
    FBGA153
    11.5X13mm
    32GB
    3D NAND
    FBGA153
    11.5X13mm
    64GB
    3D NAND
    FBGA153
    11.5X13mm



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